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언더필 재료를 사용하는 Cu/Low-K 플립 칩 패키징 공정에서 신뢰성 향상 연구
- Author(s)
- 홍석윤
- Advisor
- 이해영
- Department
- 일반대학원 전자공학과
- Publisher
- The Graduate School, Ajou University
- Publication Year
- 2012-08
- Language
- kor
- Fulltext
- Appears in Collections:
- Graduate School of Ajou University > Department of Electronic Engineering > 3. Theses(Master)
- Files in This Item:
- There are no files associated with this item.
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