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모터 구동을 위한 2-레벨 IGBT 인버터의 접합 온도 추정
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이교범 | - |
| dc.contributor.author | 김성윤 | - |
| dc.date.accessioned | 2022-11-29T03:01:15Z | - |
| dc.date.available | 2022-11-29T03:01:15Z | - |
| dc.date.issued | 2022-02 | - |
| dc.identifier.other | 31635 | - |
| dc.identifier.uri | https://dspace.ajou.ac.kr/handle/2018.oak/20942 | - |
| dc.description | 학위논문(석사)--아주대학교 일반대학원 :전자공학과,2022. 2 | - |
| dc.description.tableofcontents | 제 1 장 서론 1 제 2 장 실험 환경 4 2.1 제어 시스템 4 2.2 하드웨어 환경 5 제 3 장 IGBT 스위치 열 프로파일 8 3.1 IGBT 스위치의 전력 손실 8 3.2 손실 기반 열 프로파일 추정 13 제 4 장 온도 추정 시뮬레이션 결과 15 제 5 장 실험 결과 21 5.1 실험 장치 구성 및 세부 사양 21 5.2 실험 및 온도 측정 결과 23 제 6 장 결론 28 참고문헌 29 | - |
| dc.language.iso | kor | - |
| dc.publisher | The Graduate School, Ajou University | - |
| dc.rights | 아주대학교 논문은 저작권에 의해 보호받습니다. | - |
| dc.title | 모터 구동을 위한 2-레벨 IGBT 인버터의 접합 온도 추정 | - |
| dc.title.alternative | Estimation of Junction Temperature in a Two-Level IGBT Inverter for Motor Drives | - |
| dc.type | Thesis | - |
| dc.contributor.affiliation | 아주대학교 일반대학원 | - |
| dc.contributor.alternativeName | Seong-Yun Kim | - |
| dc.contributor.department | 일반대학원 전자공학과 | - |
| dc.date.awarded | 2022. 2 | - |
| dc.description.degree | Master | - |
| dc.identifier.localId | 1245185 | - |
| dc.identifier.uci | I804:41038-000000031635 | - |
| dc.identifier.url | https://dcoll.ajou.ac.kr/dcollection/common/orgView/000000031635 | - |
| dc.subject.keyword | IGBT | - |
| dc.subject.keyword | Junction temperature estimation | - |
| dc.subject.keyword | Motor drive | - |
| dc.subject.keyword | Thermal profile | - |
| dc.description.alternativeAbstract | This thesis presents a method for junction temperature estimation using the mathematical thermal modeling in a two-level IGBT inverter for motor drives. A power conversion system (PCS) is made up of several components, with IGBT switches being the key components determining the reliability of the PCS. One of the issues with regard to a PCS is improving its reliability, the failure of IGBTs is primarily caused by variations in the junction temperature. The thermal behavior of the IGBT switches must be described in order to forecast the PCS lifetime. The profile of load current is specific to the application, and the thermal behavior is dependent on the current that flows to the IGBT. The switch module is usually encapsulated. Therefore, an additional manufacturing process is necessary for measuring the junction temperature. The presented mathematical model-based temperature estimating method does not require an additional process for temperature measurement. An experiment is conducted using a diode-doped custom module to determine the thermal behavior of the IGBT for 11-kW IPMSM (interior permanent magnet synchronous motor) drives. The effectiveness of the presented estimation method is verified by the simulation and experimental results. | - |
- Appears in Collections:
- Graduate School of Ajou University > Department of Electronic Engineering > 3. Theses(Master)
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